Feature
1. To provide the effective volume of the device to occupy space.
2. The maximum temperature that can be played by the device node.
3. It can reduce the power loss of the device.
4. It can improve the environment (temperature, and air flow rate).
Application
IC circuit board,motherboard ,MOS tube ,TO-3P large power tube ,heat sink ,electronic audio,power amplifier,etc
Specification
Height:10mm
Width:25mm
Length:100mm
Material:aluminum
Package included
3 x Aluminum Heat Sink
Additional information
| Weight | 0.102 kg |
|---|
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