Features
– Straight-fin design with twice the height of other heatsinks for extra heat dissipation performance whether actively or passively cooled.
– Mandatory for applications in high temperature, sealed, or overclocked applications.
– The heatsinks are fabricated specifically for the Raspberry Pi.
– Peel and stick in the orientation with the most airflow.
– Reduce chip hot-spots and increase thermal dissipation surface area by 10x.
Specifications
Size:13*12*5.5mm
Package included
1 x blue heat sink
2 x copper heat sink
Additional information
| Weight | 0.007 kg |
|---|
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