Manual:Click here to open
Feature
Chip model:TEC1-7103
Dimensions:30*30*4. 3mm (71 pairs of element pairs)
Wire specification:lead length 150÷8mm RV standard wire single head 5mm tin-plated
Internal resistance:2.1-2.3┯ (ambient temperature 23÷1→, 1kHZ Ac test)
Maximum temperature difference:above 65→
Maximum current:lmax=3A
Maximum voltage:8.4V
Assembly pressure:85N/cm2
Working environment:temperature range -55→∥83→ (excessive ambient temperature will directly affect the cooling efficiency)
Encapsulation process:standard 704 silicone rubber seal all around
Packaging standard:foam box packaging, storage conditions
Ambient temperature -10→∥40→
Storage conditions:-40~60→
Device characteristics:red wire positive, black wire negative (with literal for Refrigeration surface, without literal for Heat dissipation surface)
Package includes
1 x TEC1-7103 Low-power Semiconductor Refrigeration
Additional information
| Weight | 0.15 kg |
|---|
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